Roles and Responsibilities:

Specific Job Duties: Work on high volume products based on 14nm FinFET technology with quality, yield and execution driven team members. Launch various new SoC, RF, Automotive products into high volume manufacturing. Collaborate with internal teams to understand product details, analyze test level data, correlate to inline electrical parameters and ultimately be responsible for on time new product introduction success. Monitor yield and wafer sort program changes for high volume 14nm products and engage with internal and external teams for successful launches of new products. Research products application and features, define wafer yield expectation by comparing to other similar device / process / application, prepare product schedule, check risk points, and understand customer test content and flow / analysis plans. Perform duties related to gap analysis vs expectation, test bin table definition and ET correlation, test program analysis and test spec understanding, corner analysis and characterization for PVT (process, voltage, temperature) margin, internal analysis tool bring up, and e-Failure Analysis bring up and validation. (Multiple Openings)

Shift: 1st

Skills and Qualifications:

Education, Training, Certification(s) and Minimum years of experience required 

Minimum Requirements: Master's degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a related field and 24 months of experience in the Job offered or in a related occupation.

Knowledge, Skills, Abilities, Software, and Tools

Requires 24 months of experience involving the following:

 1. Design closure (DRC/LVS);
 2. Electrical, Thermal, and Mechanical Characterization and Measurement Techniques;
 3. Data Analysis & Statistical Data Analysis Tools;
 4. Microelectronic Fabrication; and
 5. Device Physics.